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NEWS / 152. Fengwen Mu, Zhe Cheng, Shin Jingjing Shi, Seongbin Shin, Bin Xu, Junichiro Shiomi, Samuel Graham, Tadatomo Suga, High thermal boundary conductance across heterogeneous GaN-SiC bonded interfaces, ACS Applied Materials & Interfaces, 11, 33428-33434 (2019). [https://doi.org/10.1021/acsami.9b10106]
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NEWS / 152. Fengwen Mu, Zhe Cheng, Shin Jingjing Shi, Seongbin Shin, Bin Xu, Junichiro Shiomi, Samuel Graham, Tadatomo Suga, High thermal boundary conductance across heterogeneous GaN-SiC bonded interfaces, ACS Applied Materials & Interfaces, 11, 33428-33434 (2019). [https://doi.org/10.1021/acsami.9b10106]
152. Fengwen Mu, Zhe Cheng, Shin Jingjing Shi, Seongbin Shin, Bin Xu, Junichiro Shiomi, Samuel Graham, Tadatomo Suga, High thermal boundary conductance across heterogeneous GaN-SiC bonded interfaces, ACS Applied Materials & Interfaces, 11, 33428-33434 (2019). [https://doi.org/10.1021/acsami.9b10106]2019.08.22 Thu
Fengwen Mu, Zhe Cheng, Shin Jingjing Shi, Seongbin Shin, Bin Xu, Junichiro Shiomi, Samuel Graham, Tadatomo Suga, High thermal boundary conductance across heterogeneous GaN-SiC bonded interfaces, ACS Applied Materials & Interfaces, 11, 33428-33434 (2019). [https://doi.org/10.1021/acsami.9b10106]
