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NEWS / 76. Nuo Yang, Tengfei Luo, Keivan Esfarjani, Asegun Henry, Zhiting Tian, Junichiro Shiomi, Yann Chalopin, Baowen Li, Gang Chen, “Thermal interface conductance between aluminum and silicon by molecular dynamics simulations”, Journal of Computational and Theoretical Nanoscience Vol. 12, 1 (2015). [http://dx.doi.org/10.1166/jctn.2015.3710]
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NEWS / 76. Nuo Yang, Tengfei Luo, Keivan Esfarjani, Asegun Henry, Zhiting Tian, Junichiro Shiomi, Yann Chalopin, Baowen Li, Gang Chen, “Thermal interface conductance between aluminum and silicon by molecular dynamics simulations”, Journal of Computational and Theoretical Nanoscience Vol. 12, 1 (2015). [http://dx.doi.org/10.1166/jctn.2015.3710]
76. Nuo Yang, Tengfei Luo, Keivan Esfarjani, Asegun Henry, Zhiting Tian, Junichiro Shiomi, Yann Chalopin, Baowen Li, Gang Chen, “Thermal interface conductance between aluminum and silicon by molecular dynamics simulations”, Journal of Computational and Theoretical Nanoscience Vol. 12, 1 (2015). [http://dx.doi.org/10.1166/jctn.2015.3710]2014.08.21 Thu
Nuo Yang, Tengfei Luo, Keivan Esfarjani, Asegun Henry, Zhiting Tian, Junichiro Shiomi, Yann Chalopin, Baowen Li, Gang Chen, “Thermal interface conductance between aluminum and silicon by molecular dynamics simulations”, Journal of Computational and Theoretical Nanoscience Vol. 12, 1 (2015). [http://dx.doi.org/10.1166/jctn.2015.3710]
