“界面” カテゴリ一覧

Category: 界面

2022

• B. Davier, P. Dollfus, N.D. Le, S. Volz, J. Shiomi, J. Saint-Martin, J. Saint-Martin, “Revisiting thermal conductivity and interface conductance at the nanoscale”, International Journal of Heat and Mass Transfer 183, 122056 (2022). [https://doi.org/10.1016/j.ijheatmasstransfer.2021.122056]

2021

• Takashi Kodama, Nobuhiro Shinohara, Shih-Wei Hung, Bin Xu, Masanao Obori, Donguk Suh, Junichiro Shiomi, “Modulation of interfacial thermal transport between fumed silica nanoparticles by surface chemical functionalization for advanced thermal insulation”, ACS Applied Materials & Interfaces 13, 17404-17411 (2021). [https://pubs.acs.org/doi/abs/10.1021/acsami.0c11066]

• Bin Xu, Shiqian Hu, Shih-Wei Hung, Cheng Shao, Harsh Chandra, Fu-Rong Chen, Takashi Kodama, Junichiro Shiomi, “Weaker bonding can give larger thermal conductance at highly mismatched interfaces”, Science Advances 7, eabf8197 (2021). [https://www.science.org/doi/10.1126/sciadv.abf8197]

• Bin Xu, Shih-Wei Hung, Shiqian Hu, Cheng Shao, Rulei Guo, Junho Choi, Takashi Kodama, Fu-Rong Chen, Junichiro Shiomi, “Scalable monolayer-functionalized nanointerface for thermal conductivity enhancement in copper/diamond composite”, Carbon 175, 299-306 (2021). [https://www.sciencedirect.com/science/article/abs/pii/S0008622321000208]

2019

• Aun Ota, Masato Ohnishi, Hisayoshi Oshima, Hisayoshi, Takuma Shiga, Takashi Kodama, Junichiro Shiomi, Enhancing thermal boundary conductance of graphite-metal interface by triazine-based molecular bonding, ACS Applied Materials & Interfaces, 11, 37295-37301 (2019). [https://pubs.acs.org/doi/abs/10.1021/acsami.9b11951]

• Shih-Wei Hung, Shiqian Hu, Junichiro Shiomi, “Spectral control of thermal boundary conductance between copper and carbon crystals by self-assembled monolayers”, ACS Applied Electronic Materials, 1, 2594-2601 (2019). [https://doi.org/10.1021/acsaelm.9b00587]

• Fengwen Mu, Zhe Cheng, Shin Jingjing Shi, Seongbin Shin, Bin Xu, Junichiro Shiomi, Samuel Graham, Tadatomo Suga, High thermal boundary conductance across heterogeneous GaN-SiC bonded interfaces, ACS Applied Materials & Interfaces, 11, 33428-33434 (2019). [https://doi.org/10.1021/acsami.9b10106]

• Jing Liu, Shenghong Ju, Norimasa Nishiyama, Junichiro Shiomi, “Anomalously low thermal conductivity in superhard cubic-Si3N4”, Physical Review B, 100, 064303 (2019). [https://doi.org/10.1103/PhysRevB.100.064303]

• Abhishek Thote, Il Jeon, Hao-Sheng Lin, Sergei Manzhos, Takafumi Nakagawa, Donguk Suh, Junho Hwang, Makoto Kashiwagi, Junichiro Shiomi, Shigeo Maruyama, Daiguji Hirofumi, Yutaka Matsuo, “High-working-pressure Sputtering of ZnO for Stable and Efficient Perovskite Solar Cells”, ACS Applied Electronic Materials, 1, 389–396 (2019). [https://pubs.acs.org/doi/10.1021/acsaelm.8b00105]

• John Gaskins, George Kotsonis, Ashutosh Giri, Shenghong Ju, Andrew Rohskopf, Yekan Wang, Tingyu Bai, Edward Sachet, Christopher Shelton, Zeyu Liu, Zhe Cheng, Brian Foley, Samuel Graham, Tengfei Luo, Asegun Henry, Mark S. Goorsky, Junichiro Shiomi, Jon-Paul Maria, and Patrick E. Hopkins, “Corrrection to Thermal Boundary Conductance Across Heteroepitaxial ZnO/GaN Interfaces: Assessment of the Phonon Gas Model”, Nano Lett., 19, 1408–1408 (2019). [https://pubs.acs.org/doi/abs/10.1021/acs.nanolett.9b00022]

• Masato Ohnishi, Junichiro Shiomi, Perspective: Towards ultimate impedance of phonon transport by nanostructure interface, APL Materials, 7, 013102 (2019). (Open access) [https://aip.scitation.org/doi/10.1063/1.5055570]

2018

• John Gaskins, George Kotsonis, Ashutosh Giri, Shenghong Ju, Andrew Rohskopf, Yekan Wang, Tingyu Bai, Edward Sachet, Christopher Shelton, Zeyu Liu, Zhe Cheng, Brian Foley, Samuel Graham, Tengfei Luo, Asegun Henry, Mark S. Goorsky, Junichiro Shiomi, Jon-Paul Maria, and Patrick E. Hopkins, “Thermal boundary conductance across heteroepitaxial ZnO/GaN interfaces: Failures of the phonon gas model”, Nano letters, 18, 7469-7477 (2018). [https://pubs.acs.org/doi/pdf/10.1021/acs.nanolett.8b02837]

2016

• Shih-Wei Hung, Gota Kikugawa, Junichiro Shiomi, “Mechanism of temperature dependent thermal transport across the interface between self-assembled monolayer and water”, Journal of Physical Chemistry C, 120, 26678–26685 (2016). [https://10.1021/acs.jpcc.6b09516]

• H. Han, L. Feng, S. Xiong, T. Shiga, J. Shiomi, S. Volz, and Y. A. Kosevich, "Effects of phonon interference through long range interatomic bonds on the thermal interface conductance", Low Temperature Physics, Vol. 42 , 902 (2016). [http://dx.doi.org/10.1063/1.4960498]

• Masanao Obori, Satoshi Nita, Asuka Miura, Junichiro Shiomi, “Onsite synthesis of thermally percolated nanocomposite for thermal interface material”, Journal of Applied Physics, Vol. 119, 055103 (2016). [http://dx.doi.org/10.1063/1.4941275]

• Susumu Yada, Takafumi Oyake, Masanori Sakata, Junichiro Shiomi, “Filler-depletion layer adjacent to interface impacts performance of thermal interface material”, AIP Advances 6, 015117 (2016). [Open access] [http://dx.doi.org/10.1063/1.4941354.]