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NEWS / 176. Bin Xu, Shih-Wei Hung, Shiqian Hu, Cheng Shao, Rulei Guo, Junho Choi, Takashi Kodama, Fu-Rong Chen, Junichiro Shiomi, “Scalable monolayer-functionalized nanointerface for thermal conductivity enhancement in copper/diamond composite”, Carbon 175, 299-306 (2021). [https://www.sciencedirect.com/science/article/abs/pii/S0008622321000208]
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NEWS / 176. Bin Xu, Shih-Wei Hung, Shiqian Hu, Cheng Shao, Rulei Guo, Junho Choi, Takashi Kodama, Fu-Rong Chen, Junichiro Shiomi, “Scalable monolayer-functionalized nanointerface for thermal conductivity enhancement in copper/diamond composite”, Carbon 175, 299-306 (2021). [https://www.sciencedirect.com/science/article/abs/pii/S0008622321000208]
176. Bin Xu, Shih-Wei Hung, Shiqian Hu, Cheng Shao, Rulei Guo, Junho Choi, Takashi Kodama, Fu-Rong Chen, Junichiro Shiomi, “Scalable monolayer-functionalized nanointerface for thermal conductivity enhancement in copper/diamond composite”, Carbon 175, 299-306 (2021). [https://www.sciencedirect.com/science/article/abs/pii/S0008622321000208]2021.08.22 Sun
Bin Xu, Shih-Wei Hung, Shiqian Hu, Cheng Shao, Rulei Guo, Junho Choi, Takashi Kodama, Fu-Rong Chen, Junichiro Shiomi, “Scalable monolayer-functionalized nanointerface for thermal conductivity enhancement in copper/diamond composite”, Carbon 175, 299-306 (2021). [https://www.sciencedirect.com/science/article/abs/pii/S0008622321000208]