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NEWS / 184. Bin Xu, Shiqian Hu, Shih-Wei Hung, Cheng Shao, Harsh Chandra, Fu-Rong Chen, Takashi Kodama, Junichiro Shiomi, “Weaker bonding can give larger thermal conductance at highly mismatched interfaces”, Science Advances 7, eabf8197 (2021). [https://www.science.org/doi/10.1126/sciadv.abf8197]
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NEWS / 184. Bin Xu, Shiqian Hu, Shih-Wei Hung, Cheng Shao, Harsh Chandra, Fu-Rong Chen, Takashi Kodama, Junichiro Shiomi, “Weaker bonding can give larger thermal conductance at highly mismatched interfaces”, Science Advances 7, eabf8197 (2021). [https://www.science.org/doi/10.1126/sciadv.abf8197]
184. Bin Xu, Shiqian Hu, Shih-Wei Hung, Cheng Shao, Harsh Chandra, Fu-Rong Chen, Takashi Kodama, Junichiro Shiomi, “Weaker bonding can give larger thermal conductance at highly mismatched interfaces”, Science Advances 7, eabf8197 (2021). [https://www.science.org/doi/10.1126/sciadv.abf8197]2021.08.22 Sun
Bin Xu, Shiqian Hu, Shih-Wei Hung, Cheng Shao, Harsh Chandra, Fu-Rong Chen, Takashi Kodama, Junichiro Shiomi, “Weaker bonding can give larger thermal conductance at highly mismatched interfaces”, Science Advances 7, eabf8197 (2021). [https://www.science.org/doi/10.1126/sciadv.abf8197]
